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Chamber & process characterization (tool health, EEQA, finger printing, chamber matching), process models & model based sensors, dry clean, first wafer / wafer sequence effects effects, FDC (fault prediction), tool level APC, spare part assessment & qualification
Chamber & processes characterization (tool health, EEQA, finger printing, chamber matching), spare part assessment & qualification, tool level APC, arcing
Exposure tools, coater & developer tracks, tool level APC, within wafer / within die close control
EEQA and finger printing, RTP
APC for testing, die bonding, wire bonding, plating, molding
Virtual, inline, and offline metrology; soft sensors principles, large-area metrology
Hardware & software modifications, integration into existing APC systems, sensor integration
Run-to-run and wafer-to-wafer control, realtime control, control algorithms, defect inspection, test structures (wafer), sampling strategy
Application of process models, control density improvement, reduction of measurement operations and non-product wafers, throughput increase
Prediction and improvement of product parameters and yield by use of APC methods, novel methods of yield modeling and management
Real-time data collection aggregation, classification and quality, process and equipment
capability, mathematical methods and model creation, novel methods of data visualization
and data analysis
Tool interfaces and communication, sensor / actuator bus, interfaces, demands on new standards
Throughput and uptime improvement, cycle time and variability reduction, non-productive wafer and substrate reduction, tool and unit process related productivity improvement
Factory scheduling and dispatching optimization, throughput and uptime improvement, cycle time and variability reduction, automation-related productivity improvement, master data management, tracking of materials, spare parts and consumables, production planning & control, wafer handling, maintenance strategy, lean manufacturing
Design for manufacturing, future factory design, capacity and cost modeling, yield modeling & improvement, novel methods of manufacturing data analysis and visualization
Fixed and variable cost reduction, cost of ownership (CoO) and overall equipment efficiency (OEE), unit cost modelling, equipment and maintenance optimization
Global ESH strategies, facilities operations, facility systems reliability improvements, manufacturing sustainability and resource conservation